What are the technical specifications?

Supply a complete industrial-scale SMT assembly line with the following mandatory equipment and specifications: - **Pick & Place Machine**: Minimum 8 heads, 20,000 CPH speed, ±0.01 mm position accuracy, dual-mark + front-flying + IC cameras, max component height 16 mm, PCB size 450×1500 mm (without IC tray) or 395×1500 mm (with 1 IC tray), power 600W (220V/110V, 50/60Hz), air source 0.6-0.8 MPa (37 L/min max), XY drive (WON Linear Guide/THK Grinding Screw C5-2040, Panasonic A6 750W servo motor, SPM/IBG magnetic linear encoder), weight ≤1,000 kg, dimensions ≤1289×1254×1386 mm. Includes: 40 nozzles, nozzle station, short IC tray holder, extended conveyor (1.5m PCB), PCB loader/unloader (2 magazines each), signal tower, monitor, mouse, keyboard. - **Feeders**: Fixed tape feeders (40×8mm, 10×12mm, 5×16mm, 3×24mm); pneumatic reel feeders (80×8mm, 15×12mm, 5×16mm, 3×24mm, 1×32mm, 1×44mm, 1×56mm, 1×vibra); electronic reel feeders (10×8mm). - **Automatic Solder Paste Printer**: Max board size 450×350 mm, min 50×50 mm, thickness 0.4-6 mm, warpage ≤1%, max weight 3 kg, transfer speed 1500 mm/s, height 900±40 mm, orbit direction (L-R/R-L/L-L/R-R), one-stage orbit. Features: programmable elastic side clamp, automatic plate thickness adjustment, magnetic thimble support, floating intelligent printing head (dual motors), template frame 470×370 to 737×737 mm, max printing area 450×350 mm, squeegee (steel/glue, 45°/50°/60°), length 300 mm (optional 200-500 mm), height 65±1 mm, thickness 0.25 mm (DLC coating), single/double squeegee printing, demoulding 0.02-12 mm, printing speed 0-200 mm/s, pressure 0.5-10 kg, stroke ±200 mm. Cleaning: drip/dry/wet/vacuum, length 380 mm (optional 300/450/500 mm). Vision: 8×6 mm field of view, X±5.0 mm/Y±7.0 mm/θ±2.0° adjustment, SMEMA standard benchmark. Performance: repeat accuracy ±10 µm @6σ (Cpk ≥2.0), repetition ±20 µm @6σ (Cpk ≥2.0), cycle time <7s (excl. printing/cleaning), changeover <5 min. Power: AC220V±10%, 50/60Hz, 15A; air 4-6 kg/cm²; OS: Win7. Dimensions: 1152×1415×1540 mm; weight ~1000 kg. - **Automatic SMT Conveyor**: Single-phase 220V, 50/60Hz, 100W, ESD belt, speed 0.5-400 mm/min, PCB size 50×50 to 990×380 mm, GW ≤53 kg, packing size ≤110×26×73 cm, speed adjustable. - **Conveyor-Type Reflow Oven**: Chain conveyor for double-sided PCBs, oiling system, PC + PID closed-loop temperature control, peak power ≤22 kW, working power 4.5-6 kW, input 220V/380V 3-phase, max PCB size 300 mm (conveyor) or 400 mm (belt), max height 30 mm (above rail)/20 mm (below rail), heating zone ≤2080 mm, cooling zone ≤530 mm, heat-up time 20-30 min, max temp 400°C, accuracy ±1°C, PCB temp deviation ±2°C, file storage, dimensions ≤3500×1100×1250 mm, packing ≤3600×1200×1350 mm, GW ≤600 kg. - **Automatic Optical Inspection (AOI) Machine**: Scanning speed 150 cm²/s, min component 0402 (0.04×0.02 in) or 1005 (1×0.5 mm), board size 50×50 to 457×308 mm, component height clearance 35 mm, edge clearance 3 mm (bottom). Inspects SMT (chips, J-lead, gull-wing, BGA), through-hole, odd-form, connectors, headers. Detects: missing/polarity/tombstone/billboard/flipped/wrong part, solder bridges/opens/lifted leads, wettability, excess/insufficient solder, gold-finger contamination, pin-in-hole, bent pins. Measurement: X/Y/rotation, Gage R&R <10%. Vision: 80 MP sensor, PCIe, 12 µm pixel, strobe white light (dark/bright field), SAM/AI2 image processing. Conveyor height 835-990 mm, interfaces: SMEMA/RS232/Ethernet. Power: 100-120V (15A) or 220-240V (10A), 50/60Hz. Dimensions: 100×88.6×132.1 cm; weight ~219 kg. Includes: SPC software, offline defect rework station, sensor alignment target, barcode readers (1D/2D). Installation <1 hour. - **X-Ray Inspection Machine**: Sealed micro-focus tube (40-90 kV, 10-200 µA, max 8W, spot size ≤15 µm), detector (TFT industrial FPD, 768×768, 65×65 mm FOV, 5.8 Lp/mm resolution, 40 fps, 16-bit A/D). Max sample size 280×320 mm. Dimensions ≤850×1000×1700 mm; weight ≤750 kg. Power: 220V 10A/110V 15A, 50-60Hz. Control: Win7/Win10 64-bit industrial PC. Signal tower included. - **BGA Rework Machine**: AC220V±5%, 50/60Hz, power: bottom heater 1.2 kW, top heater 1.45 kW, IR preheater 2.7 kW (total ≤5.66 kW). PCB size 6×6 to 412×370 mm; BGA chip size 2×2 to 60×60 mm. IR temp zone 285×375 mm. Alignment: 2M pixel SD digital imaging, laser red-dot, accuracy ±0.02 mm. Temp control: K-type thermocouple, closed-loop, accuracy ±3°C. Vacuum adsorption (automatic). Dimensions: 685×633×850 mm; weight 76 kg. Includes: 7” HD touch screen, 15” SD display, vacuum pump, PCB fixture, vacuum sucker, reflow nozzles (10×10, 20×20, 31×31, 41×41, 35×35 mm), flux brush, temp sensor, hot air heater, infrared heater, external thermocouple, toolbox, monitor. - **PCB Loader**: PCB size 50×50 to 460×330 mm, magazine size ≤460×400×565 mm, weight ≤185 kg. Loading time ≤6s, magazine exchange ≤20s. Power: AC100-230V, single-phase, ≤300W. Air: 0.4-0.6 kPa, ≤10 L/min. Transmission height 900±30 mm (customizable), direction L→R o…

MINTEK Gauteng Request for Bid: SMT Assembly Equipment

Procurement of an industrial scale automatic printed circuit board (pcb) surface mount technology (smt) assembly equipment

Tender advertised: 12 May 2026
Briefing session (non‑compulsory): 26 May 2026 14:00 – Microsoft Teams (link provided)
Closing date for technical/tender enquiries: 05 June 2026 15:00
Tender submission deadline: 08 June 2026 12:00
Validity period of bid: 90 days from closing date

- Supply a full smt assembly line with mandatory equipment: pick-and-place machine, feeders, solder paste printer, smt conveyor, reflow oven, aoi machine, x-ray inspection, bga rework machine, pcb loader, and ergonomic workbenches. - Pick-and-place machine must have ≥8 heads, 20,000 cph speed, ±0.01mm Accuracy, and support pcb sizes up to 450×1500mm. - Solder paste printer must handle boards up to 450×350mm with ±10µm repeat accuracy and win7 os. - Reflow oven must support 220V/380V 3-phase power, max 400°c, and pid closed-loop temperature control (±1°c). - Aoi machine must inspect 0402-sized components, with 80mp sensor, 12µm resolution, and SMEMA/RS232/Ethernet interfaces. - All equipment must meet specified dimensions, power, and performance metrics (e.g., Cycle times, weight limits). - Local on-site installation support is required for ergonomic workbenches and other equipment.

Procurement of an industrial scale automatic printed circuit board (pcb) surface mount technology (smt) assembly equipment

Tender advertised: 12 May 2026
Briefing session (non‑compulsory): 26 May 2026 14:00 – Microsoft Teams (link provided)
Closing date for technical/tender enquiries: 05 June 2026 15:00
Tender submission deadline: 08 June 2026 12:00
Validity period of bid: 90 days from closing date

Tender Officer – Mintek

Email: [email protected]

Queries must be submitted in writing via the “Submit Query” button on the online tender box or by email. No telephone enquiries are accepted.

Submit the bid electronically via the Mintek Online Tender Box (link on the Mintek website).
Upload three zip files: 1) Compliance documents, 2) Tender submission with all supporting documents, 3) Financial offer.
File names must follow the format: MTK 02/2026‑[TendererName].zip and use only the file types and size limits specified on the portal.
All required tender forms (MTF 01‑06, SBD 4, SBD 6.1) and the CSD report must be completed, signed by an authorised representative and included in the appropriate zip file.
No late submissions; the portal closes exactly at 12:00 pm on 08 June 2026.
Late bids, fax, email or hard‑copy submissions will be rejected.
Disqualification risks: missing or incomplete forms, failure to upload required zip files, exceeding file size limits, not using the correct file naming convention, or submitting after the deadline.

Bids are scored on two main blocks: Functionality (80 points) and Price (20 points).
Functionality is evaluated in four phases: Administrative documents, Mandatory pre‑qualification, Mandatory technical, and Functionality criteria.
Minimum overall functionality score of 70 % is required to proceed to price evaluation.
Functionality points are allocated as follows: Track record (20 pts), Experience of key resources (15 pts), ISO accreditation (10 pts), Quality‑control plan (15 pts), Technical capability (30 pts), After‑sales support (10 pts).
Price is weighted 80 % of the final score; the lowest compliant price does not guarantee award.
Preference points (up to 20 pts) are awarded based on B‑BBEE and ownership criteria as per the Preferential Procurement Regulations 2022.
Mintek reserves the right to accept part of a bid, reject all bids, or award to a bidder who is not the lowest price if risk concerns arise.

Scope: Supply, delivery, installation, commissioning and after‑sales support for an industrial‑scale automatic PCB surface‑mount technology (SMT) assembly line.

Must include solder paste printing, high‑speed pick‑and‑place, reflow oven, AOI/X‑ray inspection, FAT/SAT, and full functional testing.
Equipment must meet the standards and specifications set out in Annexure A (throughput, placement accuracy, software traceability, Industry 4.0 readiness, spare‑parts availability, warranty of 12 months).
Supplier must provide OEM authorisation or partnership documentation.
All technical data sheets, drawings and brochures must be attached as supporting evidence.

Submit a separate zip file containing the financial offer (MTF 01‑04).
Price must be quoted in South African Rand, VAT‑inclusive, and be firm for at least 90 days after the closing date (shorter validity may lead to disqualification).
Provide bank details (MTF 06) and a signed price declaration (MTF 01).
No price escalation will be accepted unless expressly stated in the tender.
Payment terms and schedule are outlined in the GCC (section 6) and will be adhered to upon award.

Register on the National Treasury Central Supplier Database (CSD) and include the CSD number with the bid.
Provide a current Tax Clearance Status (TCS) or SARS PIN; tax compliance is mandatory.
Submit B‑BBEE verification (SANAS‑accredited certificates or sworn affidavits) to claim preference points as per the Preferential Procurement Regulations 2022.
Provide CIPC registration number and proof of company incorporation.
Meet the requirements of the Supply Chain Management Regulations (Regulation 38) and any other statutory licences applicable to the equipment.

No submission guidelines provided in the document. Obtain details from the tender notice or contact MINTEK directly for procedures, required forms, returnable documents, and disqualification risks.

Supply a complete industrial-scale SMT assembly line with the following mandatory equipment and specifications:

Pick & Place Machine: Minimum 8 heads, 20,000 CPH speed, ±0.01 mm position accuracy, dual-mark + front-flying + IC cameras, max component height 16 mm, PCB size 450×1500 mm (without IC tray) or 395×1500 mm (with 1 IC tray), power 600W (220V/110V, 50/60Hz), air source 0.6-0.8 MPa (37 L/min max), XY drive (WON Linear Guide/THK Grinding Screw C5-2040, Panasonic A6 750W servo motor, SPM/IBG magnetic linear encoder), weight ≤1,000 kg, dimensions ≤1289×1254×1386 mm. Includes: 40 nozzles, nozzle station, short IC tray holder, extended conveyor (1.5m PCB), PCB loader/unloader (2 magazines each), signal tower, monitor, mouse, keyboard.

Feeders: Fixed tape feeders (40×8mm, 10×12mm, 5×16mm, 3×24mm); pneumatic reel feeders (80×8mm, 15×12mm, 5×16mm, 3×24mm, 1×32mm, 1×44mm, 1×56mm, 1×vibra); electronic reel feeders (10×8mm).

Automatic Solder Paste Printer: Max board size 450×350 mm, min 50×50 mm, thickness 0.4-6 mm, warpage ≤1%, max weight 3 kg, transfer speed 1500 mm/s, height 900±40 mm, orbit direction (L-R/R-L/L-L/R-R), one-stage orbit. Features: programmable elastic side clamp, automatic plate thickness adjustment, magnetic thimble support, floating intelligent printing head (dual motors), template frame 470×370 to 737×737 mm, max printing area 450×350 mm, squeegee (steel/glue, 45°/50°/60°), length 300 mm (optional 200-500 mm), height 65±1 mm, thickness 0.25 mm (DLC coating), single/double squeegee printing, demoulding 0.02-12 mm, printing speed 0-200 mm/s, pressure 0.5-10 kg, stroke ±200 mm. Cleaning: drip/dry/wet/vacuum, length 380 mm (optional 300/450/500 mm). Vision: 8×6 mm field of view, X±5.0 mm/Y±7.0 mm/θ±2.0° adjustment, SMEMA standard benchmark. Performance: repeat accuracy ±10 µm @6σ (Cpk ≥2.0), repetition ±20 µm @6σ (Cpk ≥2.0), cycle time <7s (excl. printing/cleaning), changeover <5 min. Power: AC220V±10%, 50/60Hz, 15A; air 4-6 kg/cm²; OS: Win7. Dimensions: 1152×1415×1540 mm; weight ~1000 kg.

Automatic SMT Conveyor: Single-phase 220V, 50/60Hz, 100W, ESD belt, speed 0.5-400 mm/min, PCB size 50×50 to 990×380 mm, GW ≤53 kg, packing size ≤110×26×73 cm, speed adjustable.

Conveyor-Type Reflow Oven: Chain conveyor for double-sided PCBs, oiling system, PC + PID closed-loop temperature control, peak power ≤22 kW, working power 4.5-6 kW, input 220V/380V 3-phase, max PCB size 300 mm (conveyor) or 400 mm (belt), max height 30 mm (above rail)/20 mm (below rail), heating zone ≤2080 mm, cooling zone ≤530 mm, heat-up time 20-30 min, max temp 400°C, accuracy ±1°C, PCB temp deviation ±2°C, file storage, dimensions ≤3500×1100×1250 mm, packing ≤3600×1200×1350 mm, GW ≤600 kg.

Automatic Optical Inspection (AOI) Machine: Scanning speed 150 cm²/s, min component 0402 (0.04×0.02 in) or 1005 (1×0.5 mm), board size 50×50 to 457×308 mm, component height clearance 35 mm, edge clearance 3 mm (bottom). Inspects SMT (chips, J-lead, gull-wing, BGA), through-hole, odd-form, connectors, headers. Detects: missing/polarity/tombstone/billboard/flipped/wrong part, solder bridges/opens/lifted leads, wettability, excess/insufficient solder, gold-finger contamination, pin-in-hole, bent pins. Measurement: X/Y/rotation, Gage R&R <10%. Vision: 80 MP sensor, PCIe, 12 µm pixel, strobe white light (dark/bright field), SAM/AI2 image processing. Conveyor height 835-990 mm, interfaces: SMEMA/RS232/Ethernet. Power: 100-120V (15A) or 220-240V (10A), 50/60Hz. Dimensions: 100×88.6×132.1 cm; weight ~219 kg. Includes: SPC software, offline defect rework station, sensor alignment target, barcode readers (1D/2D). Installation <1 hour.

X-Ray Inspection Machine: Sealed micro-focus tube (40-90 kV, 10-200 µA, max 8W, spot size ≤15 µm), detector (TFT industrial FPD, 768×768, 65×65 mm FOV, 5.8 Lp/mm resolution, 40 fps, 16-bit A/D). Max sample size 280×320 mm. Dimensions ≤850×1000×1700 mm; weight ≤750 kg. Power: 220V 10A/110V 15A, 50-60Hz. Control: Win7/Win10 64-bit industrial PC. Signal tower included.

BGA Rework Machine: AC220V±5%, 50/60Hz, power: bottom heater 1.2 kW, top heater 1.45 kW, IR preheater 2.7 kW (total ≤5.66 kW). PCB size 6×6 to 412×370 mm; BGA chip size 2×2 to 60×60 mm. IR temp zone 285×375 mm. Alignment: 2M pixel SD digital imaging, laser red-dot, accuracy ±0.02 mm. Temp control: K-type thermocouple, closed-loop, accuracy ±3°C. Vacuum adsorption (automatic). Dimensions: 685×633×850 mm; weight 76 kg. Includes: 7” HD touch screen, 15” SD display, vacuum pump, PCB fixture, vacuum sucker, reflow nozzles (10×10, 20×20, 31×31, 41×41, 35×35 mm), flux brush, temp sensor, hot air heater, infrared heater, external thermocouple, toolbox, monitor.

PCB Loader: PCB size 50×50 to 460×330 mm, magazine size ≤460×400×565 mm, weight ≤185 kg. Loading time ≤6s, magazine exchange ≤20s. Power: AC100-230V, single-phase, ≤300W. Air: 0.4-0.6 kPa, ≤10 L/min. Transmission height 900±30 mm (customizable), direction L→R or R→L. PCB thickness ≥0.4 mm. Default magazine qty: 1. Step pitch: 10/20/30/40 mm. Max capacity: 50 pcs. Signal towers included.

Ergonomic Workbench: Height-adjustable (650-900 mm), 1650×900 mm (L×D), RAL7005/RAL7035 epoxy-coated frame, 32 mm particle board worktop with 3mm PVC lamination. Includes: adjustable shelf (optional), overhead bracket with LED light/diffuser, power outlets (3×16A 3-pin SA, 1×10A 2-pin Euro), drawer cabinet (1×150 mm drawer), stiffener plate. Additional items: 2×EW2.8 workbenches (with/without adjustable shelf, 4/8 power outlets), 4×Klima adjustable chairs (580-670 mm height, backrest), 4×ESD mats (with ground, wrist strap, bonding bracket). Local engineer required for on-site installation.

No compliance requirements (e.g., CSD, tax clearance, B-BBEE, CIDB, CIPC, professional registrations, local content) are specified in the document. Verify these with the tender notice or MINTEK directly.

Industrial-scale smt assembly line equipment for mintek

Industrial-scale smt assembly line equipment for mintek

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Supplies & Procurement Industry Profile

Critical Requirements

Typical Documents

Core procurement rules

Broad-Based Black Economic Empowerment Act (B-BBEE Act)

Constitution of the Republic of South Africa, 1996 – Section 217

Preferential Procurement Policy Framework Act (PPPFA)

Prevention and Combating of Corrupt Activities Act (PRECCA)

Public Procurement Act, 2024 (PPA)

Promotion of Access to Information Act (PAIA)

Promotion of Administrative Justice Act (PAJA)

MINTEK

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